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  maf00027fem mn103sd3 series type MN103SD3P mn103sfd3r internal rom type mask rom flash rom (byte) 640k 1024k ram (byte) 40k 64k package (lead-free) lqfp100-p-1414 minimum instruction execution time 16.7 ns (at 2.7 v to 3.6 v, 60 mhz) ? interrupts reset. irq 8 . nmi. timer 32. i 2 c 3. sif 16 . dma 12 . wdt. a/d. time base timer 2 . system error. key input. remote control 4 ? timer counter 8 -bit timer a 10 reload-down count. cascade connection possible (usable as a 16-bit to 32-bit timer) 8-bit timer b 3 interval timer. event count. square-wave output. simple pulse width measurement. pwm output 16-bit timer 6 up-down count. input capture. pwm output. compare/capture register 2 channnels time base timer 1 watchdog timer 1 ? serial interface uart/synchronous/multi-master i 2 c interface selective 3 uart/synchronous interface selective 5 ? remote contorol interface remote control reception: correspondence with aeha (association for electric home appliances) format. queued reception by low speed clock ? dma controller number of channels: 4 channels unit of transfer: 8/16/32 bits maximum transfer cycles: 65535 starting factor: external interrupt. timer. serial transmission/reception. a/d conversion ?nish. i 2 c transmission/reception. software. remote control data reception transfer method: 2-bus cycle transfer adressing modes: fixed. increment. decrement transfer mode: word transfer. burst transfer. intermittent transfer ? i/o pins i/o 81 : common use input 1 : common use ? a/d converter 10-bit 8 channels ? rom correction 8 channels ? electrical charactreistics (a/d converter characteristics) parameter symbol condition limit unit min typ max resolution 10 bits non-linear error vdd33 = vrefh = 3.3 v. vss = 0 v 4 lsb differential non-linearity error 4 lsb
maf00027fem MN103SD3P, mn103sfd3r ? pin assignment lqfp100-p-1414 p00, sbo0a, nwe0 p01, sbi0a, nwe1 p02, sbt0a, nr e p03, sbo2a, sda2a, sbt5a p04, sbi2a, sbi5 a p05, sbt2a, scl2a, sbo5 a p06, irq5b, tm20io b p10, tm4io, (ocd_sda) p1 1, tm5io, (ocd_scl ) p12, tm6io, sysclk, tm22iob mmod osco osci vs s xi, p0 7 xo vdd3 3 vdd1 8 nrst lo n p14, sbt1b, tm14ioa, sbt6 a p15, sbo1b, tm14iob, sbi6 a p16, sbi1b, tm7io, sbo6 a ocdmod p20, irq0a, dk, (vpp ) p63, key3, a2 p62, key2, a3 p61, key1, a4 p60, key0, a5 p57, key15, a6 p56, key14, a7 p55, key13, a8 p54, key12, a9 p53, key1 1, a1 0 p52, key10, a1 1 p51, key9, a12 vs s p50, key8, a13 vdd1 8 p35, sbt3a, scl3a, a1 4 p34, sbi3a, a1 5 p33, sbo3a, sda3a, a1 6 p32, sbt1a, a1 7 p31, sbi1a, a1 8 p30, sbo1a, a1 9 p25, irq5a, a2 0 p24, irq4a, nsc 3 p23, irq3a, nsc 2 p22, irq2a, nsc 1 p21, irq1a, rmin, nsc 0 vdd18 p42, sbt4, scl4, irq7, nmirq p41, sbo4, sda4, irq 6 p40, sbi4, tm13iob, d1 5 p87, tm13ioa, d1 4 p86, tm12iob, d1 3 p85, tm12ioa, d1 2 p84, tm1 1iob, d1 1 p83, tm1 1ioa, d1 0 p82, tm10iob, d9 p81, tm10ioa, d8 p8 0 vss p7 7 vdd33 p75, d7 p74, d6 p73, d5 p72, d4 p71, d3 p70, d2 p67, key7, d1 p66, key6, d0 p65, key5, a0 p64, key4, a1 p90, sbo0b p91, sbi0b, sbo5c p92, sbt0b p93, sbo3b, sda3b p94, sbi3b, sbo6c p95, sbt3b, scl3b, sbo7c pd0, sbo2b, sda2b pd1, sbi2b pd2, sbt2b, scl2b pd3, irq0b pd4, irq1b pd5, irq2b pd6, irq3b, tm15ioa vdd33 pd7, irq4b, tm15iob vss pa 0, an0, sbo7a pa 1, an1, sbi7a pa 2, an2, sbt7a pa 3, an3, tm22ioa pa 4, an4, tm21bka pa 5, an5, tm21gcp a pa 6, an6, tm21ioa pa 7, an7, tm20ioa vrefh 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805


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